well i dunno if the uBGA will make much of a difference, its just type of package.. BALL GRID ARRAY.. it supposed to have a smaller footprint than say.. TQFP or other packages.. more to the aid of the board manufacturer really than the end customers..
Infineon is quite good..., i have them.. dunno bout hyundai.. haven't tried any of them.. but the company has a good reputation..
Infineon is quite good..., i have them.. dunno bout hyundai.. haven't tried any of them.. but the company has a good reputation..